Interesting new research from Microsoft on a new cooling method, which brings vein-like cooling channels into direct contact with the silicon modelled after a leaf and other natural channels. Microsoft have proven the benefits with a Teams server simulation, which proved helpful especially with the handling spikes when class usually begin and end. Microfluidics can help smooth out the heating spikes from overclocking in periods of high demand. This can also help improve server density in datacentres, and may eventually result in new 3D chip designs. Microsoft already use their own chips in Azure, so the path to realising the advantages of this technique in their own datacentres is of their own making.
AI chips are getting hotter. A microfluidics breakthrough goes straight to the silicon to cool up to three times better. - Source
